Usecases

Electrode Process

• 

  Electrode Visual Inspection in Slitting Process

  • Real-time automated detection of scratches, dents, and foreign particles on continuously produced electrode surfaces.

Stacking Process

• 

  Electrode Plate Visual Inspection in Notching and Stacking Process

  • High-speed inspection of cosmetic defects such as foreign materials and scratches on electrode plates during stacking after notching

Assembly Process

• 

  Welding Inspection of Battery Top Surface and Can

  • Inspection of welding conditions including incomplete welding and over-welding
• 

  Internal Foreign Material Inspection Using X-ray Equipment

  • Analysis of X-ray images to inspect for positive/negative electrode fragments, metal debris, jelly roll damage, etc.

Formation Process

• 

  Jelly Roll Internal Inspection

  • Inspection of jelly roll internal conditions using CT equipment
  • Inspection of total electrode plate count, positive and negative electrode overhang, electrode bending conditions, etc.
• 

  Final Battery Visual Inspection

  • Final pre-shipment visual inspection for dents, scratches, and safety component conditions.

Module/Pack Process

• 

  Bus Bar Welding Inspection

  • Precise inspection of bus bar welding conditions to detect welding defects, incomplete welding, etc.

PCB Substrate Quality Inspection

In PCB substrate manufacturing, this stage ensures the quality of structural elements such as circuit patterns, layer alignment, drill holes, solder mask, and overall appearance. SAIGE VISION identifies even the smallest defects — from micrometer-scale alignment errors to subtle pattern flaws — at high speed and with exceptional accuracy. For high-density PCB production, AI-driven inspection is now essential to boosting both quality and productivity.

• 

  Inner Layer Inspection

  • Detects defects like line breaks, shorts, and micro dust that can occur during copper layer formation via photoresist exposure and etching
  • AI identifies qualitative defects such as scratches, dents, and unplated areas that rule-based methods may miss
  • Compares etched inner layer patterns to design files (Gerber) to ensure accuracy
• 

  Drill Inspection

  • Detects key PCB drill defects like misaligned holes, contamination, and incomplete plating
  • Uses AI classification to reduce misclassification common in rule-based systems
  • Enhances hole images for more accurate defect detection
• 

  Final Visual Inspection

  • Checks overall PCB surface, foreign materials, contamination, and printed markings before packaging
  • AI-powered segmentation detects defects that rule-based systems may miss
  • AI-based detection algorithms accurately identify and classify defects such as dents, scratches, insufficient plating, and contamination.

PCB Assembly Inspection

In PCB assembly inspection, SAIGE VISION ensures defect-free production by verifying precise component placement, detecting missing parts, and identifying soldering issues at every stage — from solder paste application to final connections. Powered by AI, it outperforms traditional methods even under reflective or changing lighting, delivering real-time feedback to fix errors instantly and cut defect-related costs.

• 

  Solder Paste Inspection (SPI)

  • Inspect solder paste position and shape for closed-loop control in PCB screen printing
  • Real-time quality inspection to detect printing issues and provide early alerts on deviations
  • Measures solder paste height, area, and volume, and detects misalignment using 3D scanning and deep learning
  • Detects defects such as sunken or raised prints, bridging, and peaking
• 

  Capacitor Soldering Inspection

  • Uses supervised learning to detect micro defects in soldering that could cause wire breakage, shorts, or other electrical issues
  • Identifies PCB resist positions and detects functional abnormalities such as bridging, peaking, and spacing variations
  • Inspects solder defects affected by light reflection that alter perceived size, shape, or form
  • Deep learning-based method quickly identifies solder resist on diodes under industrial lighting conditions
• 

  Component Placement Inspection

  • Detects and corrects component position, orientation, and missing parts in real time during SMT (Surface Mount Technology) processes
  • Checks alignment accuracy of fine-pitch components critical to PCB performance and longevity
  • Performs inspections under subtle lighting contrasts, perspective shifts, directional changes, and reflective metal surfaces